Taiwan Semiconductor Mfg. Co. Ltd. (NYSE:TSM) Q3 2019 Earnings Conference Call - Final Transcript
Oct 17, 2019 • 02:00 am ET
C. C. Wei
As our industry continues to seek innovation to enhance system level performance, TSMC's differentiating advanced packaging solution will allow us to grow the business at a pace faster than corporate in the next few years. And thank you for your attention.
This concludes our prepared statements. [Operator Instructions] Now we begin.