ASML Holding NV (NASDAQ:ASML) Q1 2019 Earnings Conference Call - Final Transcript
Apr 17, 2019 • 09:00 am ET
Thank you, sir. Ladies and gentlemen, at this time we will begin the question-and-answer session. (Operator Instructions) First question is from Mr. C.J. Muse of Evercore ISI. Go ahead please. Your line is open.
Great, thanks. Good afternoon. Thank you for taking the question. I guess first question on your memory outlook if I were to exclude, expected EUV shipments, it looks like memory half over half for you guys is roughly up 30%, give or take in the second half and so, curious there is that all largely shrinks or are you starting to see greenfield from the 3D NAND side? I'd love to hear your thoughts and any color on that from you?.
Well, thank you C.J. No capacity additions on the 3D NAND side. That's not what we're seeing. It's really technology transitions other than EUV. So it's largely in the DRAM space.
Okay, helpful. And then I guess as my follow-up, as you think about DRAM and adoption of EUV, it sounds like perhaps layer count could increase from perhaps two to as many as four layers, would love to hear how you're thinking about that -- how you're thinking about that ramp and I guess what contributions to EUV we could see into the 2020-2021 time frame?
Yes, that's a very good question. I think as you know, DRAM is much more -- we started -- I think we discussed this on previous calls also. It is much more cost sensitive than the Logic space. And actually it means that the higher productivity EUV tool the 3400C is the tool of record for DRAM manufacturing. Now clearly we're in the process of maturing the 3400C tool in terms of availability, in terms of the productivity of course which is to be proven in the customer fab. So I would expect that by the end of this year, I would say somewhere in Q4 where we see the first results of those tools in the customer fabs. And we would need the projected wafers per day productivity, which is the result of the raw throughput plus the availability. That will really drive the number of layers ultimately in application of DRAM. I would expect though that customers will first allocate a relatively small portion of their output to EUV because it's a new technology, it's a new process, but when that is proven that can accelerate.
So it's -- could really say, it's really up to us to make sure and of course together with our customers because this new technology, new process technology we need to prove that in the course of this year really towards the end of the year that the promised productivity and availability is there that we beat the 2000 wafer per day target that we've set ourselves and even see whether we can get higher. And going -- no , I would say, significantly above 2,000 wafers per day, with which ultimately should be possible will drive the adoption of the