Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC) Q1 2017 Earnings Conference Call - Final Transcript
Feb 02, 2017 • 08:00 am ET
released at this year Consumer Electronics Show in Las Vegas, the main headline was around virtual reality, self-driving cars, and the broadening proliferation of connected home devices. While there are clearly several advanced packaging opportunities, a significant amount of this new future end product relies on our core wire bonding offering.
As discussed in the past, many of these devices require LEDs, LED drivers, discreet drivers, sensors, microcontrollers, as well as Wi-Fi and Bluetooth connectivity, where production costs are most critical. We anticipate high efficiency wire bonded package and a variation of SiP to continue feeding Internet of Things' growth.
Finally, as touched on earlier, solid state drive growth is supporting dynamic NAND flash capacity requirements and will continue to be a significant demand driver in the near term. According to Gartner, the compound annual growth rate for solid state drives is anticipated to be 24% through 2020.
Collectively, we continue to be well positioned to benefit from many emerging opportunities throughout our growing business.
This concludes our prepared remarks. Operator, we will now be happy to take questions.